QUALCOMM, Intel, other chip manufacturers, and personal computer (PC) makers, including Asus and Lenovo, have made significant moves into the artificial intelligence PC market during the ongoing Consumer Electronics Show in Las Vegas, the United States. Qualcomm unveiled its Snapdragon X Platform for AI PCs at the opening of the four-day CES on Tuesday. This is the fourth platform in the X series aimed at PCs, targeting devices priced around US$600. Intel announced its second-generation Core Ultra 200V, 200HX, 200H, and 200U processors for AI PCs, all integrating its central, graphics, and neural processing units Jan. 6. Advanced Micro Devices debuted its Ryzen AI Max, AI 300, and 200 series processors, all System-on-a-Chip systems designed for AI PCs, on the same day. Unlike previously expensive AI PCs, Qualcomm, Intel, and AMD said the new chips will be used on PCs priced between 4,000 yuan (US$545) and 8,000 yuan, with shipments to start in the first half of this year. Taiwan-based Asus debuted the Zenbook A14, the world’s lightest Copilot+ PC, at the CES, while Beijing-based Lenovo unveiled its first AI tablet and its first rollable screen AI PC, the ThinkBook Plus Gen 6, which will likely launch in the first half of this year. South Korea’s Samsung Electronics will unveil its Galaxy Book4 Edge 14 during the CES, with the product positioned to enter the AI PC ultrabook market. Shipments of AI PCs are expected to have a compound annual growth rate of 44% from last year to 2028, according to data from market researcher Canalys. (SD-Agencies) | 